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説明
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg構成
構成なしOEMモデルの説明
Discontinued Mar. 2006ドキュメント
ドキュメントなし
DISCO
DFG860
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79180
ウェーハサイズ：
不明
ヴィンテージ：
2004
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説明
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg構成
構成なしOEMモデルの説明
Discontinued Mar. 2006ドキュメント
ドキュメントなし