説明
説明なし構成
Back Grinder tape manual mounter for 6 and 8in wafersOEMモデルの説明
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.ドキュメント
ドキュメントなし
ULTRON SYSTEMS INC / USI
UH108-8
検証済み
カテゴリ
Wafer Lapping
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
90074
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS INC / USI
UH108-8
カテゴリ
Wafer Lapping
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
90074
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Back Grinder tape manual mounter for 6 and 8in wafersOEMモデルの説明
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.ドキュメント
ドキュメントなし