説明
Etcher構成
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEMモデルの説明
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.ドキュメント
ドキュメントなし
カテゴリ
Wet Etch
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146874
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / SEZ
SP223
カテゴリ
Wet Etch
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146874
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Etcher構成
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEMモデルの説明
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.ドキュメント
ドキュメントなし