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ASM EAGLE 60AP
    説明
    EAGLE60AP Copper wire bonding system
    構成
    構成なし
    OEMモデルの説明
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
    ドキュメント

    ドキュメントなし

    ASM

    EAGLE 60AP

    verified-listing-icon

    検証済み

    カテゴリ
    Wire / Wedge / Ball Bonder

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    114280


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder
    ヴィンテージ: 2012状態: 中古
    最終確認60日以上前

    ASM

    EAGLE 60AP

    verified-listing-icon
    検証済み
    カテゴリ
    Wire / Wedge / Ball Bonder
    最終検証: 60日以上前
    listing-photo-438d3d02aca9403f98c432377b3a719f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    114280


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    EAGLE60AP Copper wire bonding system
    構成
    構成なし
    OEMモデルの説明
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 2012状態: 中古最終検証:60日以上前
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 0状態: 中古最終検証:60日以上前
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 2006状態: 中古最終検証:60日以上前