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ASM EAGLE 60AP
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
    ドキュメント

    ドキュメントなし

    ASM

    EAGLE 60AP

    verified-listing-icon

    検証済み

    カテゴリ
    Wire / Wedge / Ball Bonder

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    76749


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonder
    ヴィンテージ: 2012状態: 中古
    最終確認60日以上前

    ASM

    EAGLE 60AP

    verified-listing-icon
    検証済み
    カテゴリ
    Wire / Wedge / Ball Bonder
    最終検証: 60日以上前
    listing-photo-7e07098137f74a7a850701271a818b90-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    76749


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 2012状態: 中古最終検証:60日以上前
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 0状態: 中古最終検証:30日以上前
    ASM EAGLE 60AP

    ASM

    EAGLE 60AP

    Wire / Wedge / Ball Bonderヴィンテージ: 2010状態: 中古最終検証:30日以上前