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説明
説明なし構成
構成なしOEMモデルの説明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonderドキュメント
ドキュメントなし
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
76756
ウェーハサイズ：
不明
ヴィンテージ：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ASM
EAGLE XTREME GOCU
カテゴリ
Wire / Wedge / Ball Bonder
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
76756
ウェーハサイズ：
不明
ヴィンテージ：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonderドキュメント
ドキュメントなし