説明
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker構成
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEMモデルの説明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.ドキュメント
ドキュメントなし
検証済み
カテゴリ
X-Ray / XRD / XRF
最終検証： 30日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
136273
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BRUKER
D8 FABLINE
カテゴリ
X-Ray / XRD / XRF
最終検証： 30日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
136273
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker構成
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEMモデルの説明
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.ドキュメント
ドキュメントなし