説明

The Matrix 105 plasma Asher Plasma descum semiconductor equipment represents the Industry Standard in single-wafer photoresist removal and the mainstay of the highly successful System One family. Developed in cooperation with many of the world’s leading IC producers, the Matrix 105 plasma Asher Plasma descum semiconductor equipment has been designed for optimum performance and Cost of Ownership. The Model 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round or square, and ranging from 50mm up to 150mm. By maintaining independent closed-loop system controls, the system optimizes vital device parameters: • Enhanced gate oxide integrity • Reduced threshold and capacitance voltage shifts • Reduced contact resistance/ oxidation. Single Wafer, Multi-Step Processing • Precisely controlled & repeatable stripping of each wafer • 3 programmable steps + overstrip • Capable of long process times for exceptional control High Throughput • >35 WPH on 150mm substrates (60 second process time) Aluminum Wafer Chuck Provides Fast, Precise, Uniform Removal of Resist Low Particles <0.1 particles (>0.3μm) added per cm2 Proven System Performance >700 System Ones in use worldwide, >95% uptime Proven Reactor Design Optically dense and mechanically robust quartz baffle assembly provides separation of wafer from plasma for true “downstream” performance, with maximum gate oxide protection Closed-Loop Temperature Control Resistively heated wafer chuck, stable range for strip: 150°C – 250ºC (+/-5°C), for descum: 70°C – 150ºC (+/-5°C), provides precise temperature control and reduces thermal degradation and electrical damage. Photocell Endpoint Automatic endpoint detection for optimizing throughput. Pick-and-Place Wafer Handling Brooks Orbitran® system, cassette to cassette wafer handling Production Oriented Easy to learn, one-button operation Process recipe stored on magnetic card System Diagnostics/Modularity Maintenance is quick and simple Small Footprint Only 25” W x 28” D (63.5cm x 71cm)

構成

Process Gasses: O2 and N2 • High dose implant (As+, B+, P+) • Post-polysilicon etch • Post-metal etch • Post-oxide etch • Rework Controlled Resist Removal • Post-develop descum (pre-etch) • Dry/wet process capability • Uniformity capability (<5% 1σ) GaAs, InP wafer Strip and Descum Thin Film Head Resist Cleaning Opto-Electronic Devices Cleaning MEMS (Micro Systems Technology)

OEMモデルの説明

The Matrix System One Model 105 Asher is a single chamber, automatic microprocessor-controlled photoresist stripper that is set up for 4″ – 6″ wafers. It is configured for up to 6″ wafers and has independent control of pressure, RF power, temperature, gas flow, & substrate position. The Matrix 105 Asher has a 600W RF water-cooled generator and a multi-step program (three steps + over etch) process program. It also has a “Butterfly” Valve for more precise pressure control and a phase magnitude detector to provide real-time RF impedance matching control. The Matrix 105 Asher has two Mass Flow Controllers and a Vacuum Hose Assembly. The range for Strip is 150C to 250C +/-5C and the range for Descum is 70C to 150C +/-5C. It also has a Wafer Lift Pin Assembly (up and down).