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APPLIED MATERIALS (AMAT) NANOSEM 3D
    説明
    説明なし
    構成
    Software Version: 14.3.0 CIM: SECS/GEM Process: CDSEM Main System: AMAT NanoSEM 3D (1) OK Handler System: ETU (1) OK Factory Interface: FOUP Dry Pump (2) OK
    OEMモデルの説明
    Introduced in fiscal 2002, the NanoSEM 3D system extends CD-SEM technology beyond the measurement of critical dimensions to enable the three-dimensional imaging of chip features to more precisely control their lithography and etch processes.
    ドキュメント

    ドキュメントなし

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    verified-listing-icon

    検証済み

    カテゴリ
    CD-SEM

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    111894


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2004


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) NANOSEM 3D

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    CD-SEM
    ヴィンテージ: 2004状態: 中古
    最終確認30日以上前

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    verified-listing-icon
    検証済み
    カテゴリ
    CD-SEM
    最終検証: 60日以上前
    listing-photo-ece70ab333ed41df83ed3439969f5a21-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    111894


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2004


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    Software Version: 14.3.0 CIM: SECS/GEM Process: CDSEM Main System: AMAT NanoSEM 3D (1) OK Handler System: ETU (1) OK Factory Interface: FOUP Dry Pump (2) OK
    OEMモデルの説明
    Introduced in fiscal 2002, the NanoSEM 3D system extends CD-SEM technology beyond the measurement of critical dimensions to enable the three-dimensional imaging of chip features to more precisely control their lithography and etch processes.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    APPLIED MATERIALS (AMAT) NANOSEM 3D

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    CD-SEMヴィンテージ: 2004状態: 中古最終検証:30日以上前
    APPLIED MATERIALS (AMAT) NANOSEM 3D

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    CD-SEMヴィンテージ: 2004状態: 中古最終検証:60日以上前
    APPLIED MATERIALS (AMAT) NANOSEM 3D

    APPLIED MATERIALS (AMAT)

    NANOSEM 3D

    CD-SEMヴィンテージ: 2003状態: 中古最終検証:60日以上前