説明
説明なし構成
• Single coater modules (spin coat, not spray coat) • 12” bowl • Edge-handling chucks (4”, 6”, 8”, 12”) • Vacuum Chucks (4”, 6”, 8”, 12”) • Edge Bead Rinse • Back Side Rinse • Min 2x (4x preferred) syringe pump • Min 1x (2x preferred) cyberpump • dispense arm • Exhaust through bench • EBR angled-nozzleOEMモデルの説明
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.ドキュメント
ドキュメントなし
カテゴリ
Coaters & Developers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
155031
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
EVGROUP (EVG)
EVG101
カテゴリ
Coaters & Developers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
155031
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
• Single coater modules (spin coat, not spray coat) • 12” bowl • Edge-handling chucks (4”, 6”, 8”, 12”) • Vacuum Chucks (4”, 6”, 8”, 12”) • Edge Bead Rinse • Back Side Rinse • Min 2x (4x preferred) syringe pump • Min 1x (2x preferred) cyberpump • dispense arm • Exhaust through bench • EBR angled-nozzleOEMモデルの説明
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.ドキュメント
ドキュメントなし