説明

Spray coater with hotplate module

構成

Details Attached - Model: EVG 101 - Semi-Automatic, with Manual loading - Suitable for wafer sizes 3" - 8" wafers (with proper chuck) - Currently configured for 4" & 6" wafers - One Coat Module - Base frame for one resist processing module including all electronics, pneumatics, tubing for solvents, drain or dump container, and exhaust lines - Manual loading and mechanical pre-aligner (pneumatically actuated) - PC controlled with windows based graphical user interface - Password protected access levels - Coat chamber PTFE for spin coating - Programmable rotational speed for substrate - Programmable arm for resist dispense and topside EBR - One Cybor pump - Syringe dispense option included - External Chemical cabinet with two solvents - Previously used chemistry: 1813, 1827, acetone and IPA. - Operations Manual and Documentation included - Excellent Condition Guaranteed EVG 101 REFURBISHMENT PROCESS consisting of: Receiving and Preparation Process: - Initial cleaning, decontamination and preparation for reconditioning process. - Initial functional and cosmetic inspection. - Disassembly of all chambers)/tank(s) and key components, initial testing to sort and select acceptable parts/assemblies. - Components and assemblies sent to repair areas for servicing. Reconditioning Process: - System is thoroughly cleaned inside and out - Chamber receives full clean, tubing cleaned and replaced as necessary - Decontamination of any acids or solvents remaining from previous process - Full electrical systems test, components replaced with new or rebuilt parts, as necessary - Each chamber, station and/or module serviced and tested individually, reassembled into deck and re-tested thoroughly - Seals and gaskets replaced as necessary - Pumps refurbished and calibrated - Spin Motor tested and refurbished or replaced as needed - System is fully tested

OEMモデルの説明

EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.