説明
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.構成
構成なしOEMモデルの説明
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.ドキュメント
ドキュメントなし
KLA
AIT II
検証済み
カテゴリ
Defect Inspection
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
24647
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
AIT II
検証済み
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
24647
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.構成
構成なしOEMモデルの説明
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.ドキュメント
ドキュメントなし