説明
Cu Barrier Seed depostion構成
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEMモデルの説明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.ドキュメント
ドキュメントなし
LAM RESEARCH / NOVELLUS
INOVA
検証済み
カテゴリ
Deposition
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
50644
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / NOVELLUS
INOVA
検証済み
カテゴリ
Deposition
最終検証： 16日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
50644
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Cu Barrier Seed depostion構成
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEMモデルの説明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.ドキュメント
ドキュメントなし