説明
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.構成
構成なしOEMモデルの説明
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.ドキュメント
ドキュメントなし
ASM
AD838
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79228
ウェーハサイズ：
4"/100mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ASM
AD838
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79228
ウェーハサイズ：
4"/100mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.構成
構成なしOEMモデルの説明
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.ドキュメント
ドキュメントなし