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ASM AD838
  • ASM AD838
  • ASM AD838
  • ASM AD838
説明
説明なし
構成
構成なし
OEMモデルの説明
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Die Bonders / Sorters / Attachers

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

110299


ウェーハサイズ:

6"/150mm, 8"/200mm


ヴィンテージ:

2012


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
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ASM

AD838

verified-listing-icon
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
listing-photo-d90673562fa24148a033fbffd3c052c6-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

110299


ウェーハサイズ:

6"/150mm, 8"/200mm


ヴィンテージ:

2012


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
構成なし
OEMモデルの説明
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
ドキュメント

ドキュメントなし

同様のリスト
すべて表示