説明
Flip Chip Attach構成
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEMモデルの説明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.ドキュメント
ドキュメントなし
BESI / ESEC
2100
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116385
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BESI / ESEC
2100
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116385
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Flip Chip Attach構成
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEMモデルの説明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.ドキュメント
ドキュメントなし