説明
Flip Chip Attach構成
構成なしOEMモデルの説明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.ドキュメント
ドキュメントなし
BESI / ESEC
2100
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116383
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BESI / ESEC
2100
カテゴリ
Die Bonders / Sorters / Attachers
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116383
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Flip Chip Attach構成
構成なしOEMモデルの説明
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.ドキュメント
ドキュメントなし