説明
Fully functional, in production clean room構成
6, 8 and 12in wafer mounted on 17 in frameOEMモデルの説明
Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or largerドキュメント
MI EQUIPMENT
MI20
検証済み
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
106566
ウェーハサイズ:
6"/150mm, 8"/200mm, 12"/300mm
ヴィンテージ:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MI EQUIPMENT
MI20
カテゴリ
Die Bonders / Sorters / Attachers
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
106566
ウェーハサイズ:
6"/150mm, 8"/200mm, 12"/300mm
ヴィンテージ:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available