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PANASONIC MD-P200
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    ドキュメント

    PANASONIC

    MD-P200

    verified-listing-icon

    検証済み

    カテゴリ
    Die Bonders / Sorters / Attachers

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75482


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers
    ヴィンテージ: 2021状態: 中古
    最終確認60日以上前

    PANASONIC

    MD-P200

    verified-listing-icon
    検証済み
    カテゴリ
    Die Bonders / Sorters / Attachers
    最終検証: 60日以上前
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/f2c2b545d6f242f59e9ae8bc9650b48b_6b890de09d78403f9b99bf3f1ad95ed91201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3ec38e71dbba4aee885d96cd09065bcc_0716f6aa56384f5b8231f110776cfeb345005c_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/c7e6e16ba1884f168d8fa14e5afd09e0_23f9b896e19c40979ea27b96236e2faa1201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/e97984aa302041b692970336a3004012_41bd8b999aa84e06ba3d2281b6ae11251201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3a5b24a12cf34962beedcff4ebe8184e_991ae0c8a99d4fe7b96ddef22c7e791745005c_mw.jpeg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75482


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    ドキュメント
    同様のリスト
    すべて表示
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachersヴィンテージ: 2021状態: 中古最終検証:60日以上前
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachersヴィンテージ: 2022状態: 中古最終検証:60日以上前