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PANASONIC MD-P200
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    ドキュメント

    PANASONIC

    MD-P200

    verified-listing-icon

    検証済み

    カテゴリ
    Die Bonders / Sorters / Attachers

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75480


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers
    ヴィンテージ: 2021状態: 中古
    最終確認60日以上前

    PANASONIC

    MD-P200

    verified-listing-icon
    検証済み
    カテゴリ
    Die Bonders / Sorters / Attachers
    最終検証: 60日以上前
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/b3ade7ce335b46d8a5f2b949152cb4f6_21e14ccb689d4506a1aa53a457aa2f2645005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/60f73edf223f4cbe83e3602e6ad56957_fc079d33c9714131a32ab4afad3fe20445005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/08750c8ba1ce487d89e1bf6375fa08b0_d4005bb0777d4bf49187b6009f2b3eb345005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/c2be4d59889049148b87eee0cb3e9f9f_92c6a88e39454ba4adf4bd94192a39fb45005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/bfa0bad88706443eb692ae635fcd3ba2_82c03bb140d84c708f3a92e4b842a94945005c_mw.jpeg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    75480


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    ドキュメント
    同様のリスト
    すべて表示
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachersヴィンテージ: 2021状態: 中古最終検証:60日以上前
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachersヴィンテージ: 2022状態: 中古最終検証:60日以上前