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説明
DRIE構成
構成なしOEMモデルの説明
With market leading etch rates using a conventional de-coupled plasma source, the HRM provides a cost effective Deep Reactive lon Etch (DRIE) processing chamber. Designed to offer high etch rates while controlling ion damage, the HRM is ideal for deep anisotropic silicon etching using STS' ASE® process technology.ドキュメント
ドキュメントなし
STS
HRM
カテゴリ
Dry / Plasma Etch
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
126145
ウェーハサイズ：
4"/100mm, 6"/150mm, 8"/200mm
ヴィンテージ：
不明
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説明
DRIE構成
構成なしOEMモデルの説明
With market leading etch rates using a conventional de-coupled plasma source, the HRM provides a cost effective Deep Reactive lon Etch (DRIE) processing chamber. Designed to offer high etch rates while controlling ion damage, the HRM is ideal for deep anisotropic silicon etching using STS' ASE® process technology.ドキュメント
ドキュメントなし