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TEL / TOKYO ELECTRON TELINDY
  • TEL / TOKYO ELECTRON TELINDY
  • TEL / TOKYO ELECTRON TELINDY
  • TEL / TOKYO ELECTRON TELINDY
説明
Model: TELINDY B-L Process: DIFF (D-Poly) Wafer Type: 300mm Status: De-Installed TEL Indy Poly 4
構成
Please see attached configuration
OEMモデルの説明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.
ドキュメント
カテゴリ
Furnaces / Diffusion

最終検証: 30日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

78750


ウェーハサイズ:

12"/300mm


ヴィンテージ:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示

TEL / TOKYO ELECTRON

TELINDY

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検証済み
カテゴリ
Furnaces / Diffusion
最終検証: 30日以上前
listing-photo-1bb9f439e824481b8945232640fed140-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

78750


ウェーハサイズ:

12"/300mm


ヴィンテージ:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Model: TELINDY B-L Process: DIFF (D-Poly) Wafer Type: 300mm Status: De-Installed TEL Indy Poly 4
構成
Please see attached configuration
OEMモデルの説明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.
ドキュメント
同様のリスト
すべて表示