説明
Tel Indy IRAD構成
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEMモデルの説明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
TELINDY
検証済み
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
103932
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
TELINDY
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
103932
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Tel Indy IRAD構成
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEMモデルの説明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.ドキュメント
ドキュメントなし