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説明
Tool is deinstalled and crated構成
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
51170
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
51170
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Tool is deinstalled and crated構成
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし