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説明
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new構成
構成なしOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
76556
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
76556
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
PC - Serial Board for four RS-232 Ports - Camera Cables (length: 1.5m each) - Cognex MVS8100 Frame Grabber Card - Camera Breakout Cable for MVS Frame Grabber Card - EPROM - Windows 2000 - Back-up hard drive will be made on site for customer to keep - This PC will match the existing configuration of your EVG 620 - Condition: new構成
構成なしOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし