説明
説明なし構成
Automated Mask Aligner Wafer Size: 8" Equipment Configuration: Wafer Configuration: 9" inch mask holder square, 8" wafer chuckDouble-sided/Backside Alignment Capability Manual Load Motorized illuminator 1000w lamp (joystick)- Manual XYZ stage (coarse and finePCadiustments-Includes:Lamp,MirrorandOptOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし
カテゴリ
Mask/Bond Aligners
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120507
ウェーハサイズ：
不明
ヴィンテージ：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
カテゴリ
Mask/Bond Aligners
最終検証： 10日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
120507
ウェーハサイズ：
不明
ヴィンテージ：
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Automated Mask Aligner Wafer Size: 8" Equipment Configuration: Wafer Configuration: 9" inch mask holder square, 8" wafer chuckDouble-sided/Backside Alignment Capability Manual Load Motorized illuminator 1000w lamp (joystick)- Manual XYZ stage (coarse and finePCadiustments-Includes:Lamp,MirrorandOptOEMモデルの説明
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.ドキュメント
ドキュメントなし