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Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
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DISCO
DAG810
カテゴリ
Wafer Grinding
最終検証： 28日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
119962
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2017
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説明
説明なし構成
Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
ドキュメントなし