We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む
説明
Wafer Grinding構成
構成なしOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
ドキュメントなし
PREFERRED
SELLER
カテゴリ
Wafer Grinding
最終検証： 7日前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
126246
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PREFERRED
SELLER
DISCO
DAG810
カテゴリ
Wafer Grinding
最終検証： 7日前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
126246
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wafer Grinding構成
構成なしOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
ドキュメントなし