説明
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.構成
構成なしOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
ドキュメントなし
同様のリスト
すべて表示
DISCO
DAG810
カテゴリ
Wafer Grinding
最終検証： 13日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
140557
ウェーハサイズ：
不明
ヴィンテージ：
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.構成
構成なしOEMモデルの説明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.ドキュメント
ドキュメントなし