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DFG850
カテゴリ
Wafer Grinding概要（Overview）
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
現在の掲載品
9
サービス
検査、保証、鑑定、ロジスティクス
