説明
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.構成
構成なしOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし
DISCO
DFG850
検証済み
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79199
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFG850
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79199
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.構成
構成なしOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし