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説明
説明なし構成
-standard handling with standard chuck and vacuum EEF -RDM module (rinse and dry module for special clean and dry application after process on standard chuck; removes ---chemical residues at frontside after standard process on chuck ) -windows 3.11 operating system (very stable) -very new chemical modules (3pcs) with new chemical controller -standard Brooks ATM robot handlings system -running operating system with tool SW -TestedOEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし
カテゴリ
Wet Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116204
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / SEZ
SP203
カテゴリ
Wet Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116204
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-standard handling with standard chuck and vacuum EEF -RDM module (rinse and dry module for special clean and dry application after process on standard chuck; removes ---chemical residues at frontside after standard process on chuck ) -windows 3.11 operating system (very stable) -very new chemical modules (3pcs) with new chemical controller -standard Brooks ATM robot handlings system -running operating system with tool SW -TestedOEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし