説明
説明なし構成
-General Information Cleaning purpose: Back side PolySi removal Equipment classification: Process one by one -Equipment configuration Wafer Type: 26 slots,200mm, Notch Number of cassette sets: 2 cassette SMIF: SMIF-POD (ASYST) -System configuration Wafer robot: Wafer removal and storage from cassette Eco gripper: 2 pairs on the left and right Elevating unit: Lifting and lowering the chuck and dispenser Chuck: Wafer floating by N2 blow Wafer fixing: Fix the wafer with 6 pins Chuck rotation speed: 400～2000rpm Medium dispenser: Arm that supplies chemicals Process pot: The chemical solution is separated and drained with a 4-layer structure Etching position: 1 to 3 from the bottom Rinse and dry position: Top rank CDS(Chemical dispense system): 3 line Chemical configuration Level 1 Unused Level 2 HNO3+DIW （Unused） Level 3 HF+H2O2 Level 4 DIW dispenser nozzle configuration Chemical 3 line DIW 1 line N2 1 line Heat Exchangers configuration Medium DIW Temperature setting range Room temperature～50℃OEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし
カテゴリ
Wet Etch
最終検証： 6日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146833
ウェーハサイズ：
不明
ヴィンテージ：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / SEZ
SP203
カテゴリ
Wet Etch
最終検証： 6日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
146833
ウェーハサイズ：
不明
ヴィンテージ：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-General Information Cleaning purpose: Back side PolySi removal Equipment classification: Process one by one -Equipment configuration Wafer Type: 26 slots,200mm, Notch Number of cassette sets: 2 cassette SMIF: SMIF-POD (ASYST) -System configuration Wafer robot: Wafer removal and storage from cassette Eco gripper: 2 pairs on the left and right Elevating unit: Lifting and lowering the chuck and dispenser Chuck: Wafer floating by N2 blow Wafer fixing: Fix the wafer with 6 pins Chuck rotation speed: 400～2000rpm Medium dispenser: Arm that supplies chemicals Process pot: The chemical solution is separated and drained with a 4-layer structure Etching position: 1 to 3 from the bottom Rinse and dry position: Top rank CDS(Chemical dispense system): 3 line Chemical configuration Level 1 Unused Level 2 HNO3+DIW （Unused） Level 3 HF+H2O2 Level 4 DIW dispenser nozzle configuration Chemical 3 line DIW 1 line N2 1 line Heat Exchangers configuration Medium DIW Temperature setting range Room temperature～50℃OEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし