説明
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 Phase構成
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし
カテゴリ
Wet Etch
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
142800
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH / SEZ
SP203
カテゴリ
Wet Etch
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
142800
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 Phase構成
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEMモデルの説明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.ドキュメント
ドキュメントなし