説明
KLA-Tencor Candela CS20 *. Fully refurbished. Installed in Clean-room. Possible demo anytime.構成
Working Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, Sapphire)OEMモデルの説明
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).ドキュメント
ドキュメントなし
KLA
CANDELA CS20
検証済み
カテゴリ
Defect Inspection
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
65980
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
KLA
CANDELA CS20
検証済み
カテゴリ
Defect Inspection
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
65980
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
KLA-Tencor Candela CS20 *. Fully refurbished. Installed in Clean-room. Possible demo anytime.構成
Working Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, Sapphire)OEMモデルの説明
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).ドキュメント
ドキュメントなし