説明
Mobile Charge Function Slab for calibration構成
DP + SPV + SILC working condition 200MM waferOEMモデルの説明
The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more.ドキュメント
ドキュメントなし
SEMILAB
FAAST 230
検証済み
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
Deinstalled
製品ID：
66386
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SEMILAB
FAAST 230
カテゴリ
Defect Inspection
最終検証： 60日以上前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
Deinstalled
製品ID：
66386
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Mobile Charge Function Slab for calibration構成
DP + SPV + SILC working condition 200MM waferOEMモデルの説明
The SEMILAB FAAST 230 is a non-contact, fast in-line monitoring system designed to detect heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, in a medium to high-volume manufacturing environment. It features automated wafer handling, with options for SMIF/FOUP Loadport/Versaport, and can perform full wafer FAST mapping of diffusion length, Iron, and other recombination centers. The system is configurable for 100 mm to 300 mm wafers and is compatible with other Semilab SDI FAaST tool measurement technologies. Additional options include a minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, and more.ドキュメント
ドキュメントなし