説明
FURNACE構成
DCS SiNOEMモデルの説明
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
TELFORMULA
検証済み
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
51981
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
TELFORMULA
カテゴリ
Furnaces / Diffusion
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
51981
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
FURNACE構成
DCS SiNOEMモデルの説明
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.ドキュメント
ドキュメントなし