説明
説明なし構成
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEMモデルの説明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."ドキュメント
ドキュメントなし
SUSS MicroTec / KARL SUSS
MJB3
検証済み
カテゴリ
Mask Aligner
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13966
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SUSS MicroTec / KARL SUSS
MJB3
カテゴリ
Mask Aligner
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13966
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Karl Suss MJB3-IR Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.OEMモデルの説明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."ドキュメント
ドキュメントなし