説明
説明なし構成
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEMモデルの説明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."ドキュメント
ドキュメントなし
SUSS MicroTec / KARL SUSS
MJB3
検証済み
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
62965
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SUSS MicroTec / KARL SUSS
MJB3
カテゴリ
Mask/Bond Aligners
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
62965
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEMモデルの説明
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."ドキュメント
ドキュメントなし