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ACCRETECH / TSK A-WD-10A
  • ACCRETECH / TSK A-WD-10A
  • ACCRETECH / TSK A-WD-10A
  • ACCRETECH / TSK A-WD-10A
説明
AUTOMATIC DICNG SAW
構成
構成なし
OEMモデルの説明
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.
ドキュメント

ドキュメントなし

ACCRETECH / TSK

A-WD-10A

verified-listing-icon

検証済み

カテゴリ
Scribing, Cutting, Dicing

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

69279


ウェーハサイズ:

不明


ヴィンテージ:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ACCRETECH / TSK

A-WD-10A

verified-listing-icon
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証: 60日以上前
listing-photo-6fc1d9f7444f430ba2fc79adeaf81d18-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

69279


ウェーハサイズ:

不明


ヴィンテージ:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
AUTOMATIC DICNG SAW
構成
構成なし
OEMモデルの説明
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.
ドキュメント

ドキュメントなし