メインコンテンツにスキップ
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 続きを読む

Moov logo

Moov Icon
AXCELIS / FUSION 200 PCU
  • AXCELIS / FUSION 200 PCU
  • AXCELIS / FUSION 200 PCU
  • AXCELIS / FUSION 200 PCU
説明
説明なし
構成
構成なし
OEMモデルの説明
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.
ドキュメント

ドキュメントなし

PREFERRED
 
SELLER
カテゴリ
UV-Curing

最終検証: 昨日

Buyer pays 12% premium of final sale price
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

121206


ウェーハサイズ:

6"/150mm, 8"/200mm


ヴィンテージ:

1995


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PREFERRED
 
SELLER

AXCELIS / FUSION

200 PCU

verified-listing-icon
検証済み
カテゴリ
UV-Curing
最終検証: 昨日
listing-photo-80f25ddccb274c5abb3d2bd42fb2700b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

121206


ウェーハサイズ:

6"/150mm, 8"/200mm


ヴィンテージ:

1995


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
構成なし
OEMモデルの説明
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.
ドキュメント

ドキュメントなし

同様のリスト
すべて表示