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説明
説明なし構成
構成なしOEMモデルの説明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.ドキュメント
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DISCO
DFG840
カテゴリ
Wafer Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
105641
ウェーハサイズ：
不明
ヴィンテージ：
1995
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説明
説明なし構成
構成なしOEMモデルの説明
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.ドキュメント
ドキュメントなし