説明
説明なし構成
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrate thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 115V 12A 50/60Hz - Input Air: CDA 90 PSI - Option: Cognex Wafer IDOEMモデルの説明
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.ドキュメント
ドキュメントなし
検証済み
カテゴリ
Defect Inspection
最終検証： 9日前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
153576
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
KLA
CANDELA 8620
カテゴリ
Defect Inspection
最終検証： 9日前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
153576
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrate thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 115V 12A 50/60Hz - Input Air: CDA 90 PSI - Option: Cognex Wafer IDOEMモデルの説明
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.ドキュメント
ドキュメントなし