説明
The system includes 2” and 4” platens構成
790+ RIE CF4 CHF3 Ar O2 N2OEMモデルの説明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.ドキュメント
ドキュメントなし
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
127361
ウェーハサイズ：
不明
ヴィンテージ：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PLASMATHERM
790
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Running
製品ID：
127361
ウェーハサイズ：
不明
ヴィンテージ：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The system includes 2” and 4” platens構成
790+ RIE CF4 CHF3 Ar O2 N2OEMモデルの説明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.ドキュメント
ドキュメントなし