説明
Including: Leybold D40BCS, Neslab HX75 Chiller, Manuals. Gases Used: Ar, SF6, N2, O2構成
構成なしOEMモデルの説明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.ドキュメント
ドキュメントなし
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 7日前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
138675
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PLASMATHERM
790
カテゴリ
Dry / Plasma Etch
最終検証： 7日前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
138675
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Including: Leybold D40BCS, Neslab HX75 Chiller, Manuals. Gases Used: Ar, SF6, N2, O2構成
構成なしOEMモデルの説明
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.ドキュメント
ドキュメントなし