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説明
C1 Line, A1 Underfloor Storage Facility構成
構成なしOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし
同様のリスト
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DISCO
DFG850
カテゴリ
Wafer Grinding
最終検証： 27日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124599
ウェーハサイズ：
5"/125mm, 6"/150mm
ヴィンテージ：
不明
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説明
C1 Line, A1 Underfloor Storage Facility構成
構成なしOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし