説明
説明なし構成
as-is no missing parts can turn onOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし
DISCO
DFG850
検証済み
カテゴリ
Wafer Grinding
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Down
製品ID:
73566
ウェーハサイズ:
不明
ヴィンテージ:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG850
カテゴリ
Wafer Grinding
最終検証: 30日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Down
製品ID:
73566
ウェーハサイズ:
不明
ヴィンテージ:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
as-is no missing parts can turn onOEMモデルの説明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.ドキュメント
ドキュメントなし